What We Do

Laser Processing of Metals and Polymers

Our laser systems deliver unmatched accuracy for cutting, welding, drilling, and shaping complex geometries in both metallic and polymer-based materials.

Part A

Welded, cutting and marking on 304 stainless steel
Tube = .248" OD X .027" wall X 1.5" length
Slots = .027" wide X .658" length

Capabilities & Specifications

Part B

Cutting and marking on 316 stainless steel
Tube = .127" OD X.016" wall X .538" length
Slot = .057" X .252 length and .030" X .090"

Capabilities & Specifications

Capabilities & Specifications

Part C

Braid reinforced polyimide with PTFE liner
Ablation through polyimide and through PTFE
Tube = .096" OD X .006" wall
Slot = .030" wide X .125" length

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Micro Machining and Welding

Our micro-scale manufacturing processes achieve ultra-fine features and tight tolerances essential to miniaturized medical devices.

Capabilities & Specifications

304 stainless steel cable welded to stainless steel band
Cable = 12 strand X .009" diameter
Anchor band = .092" OD X .010" wall

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High-Definition Marking

Using advanced laser technology, we produce deep, ultra-dark marks for logos, serial numbers, part identifiers, and orientation or depth indicators — all with crisp definition and exceptional readability.

Complex Sub-assemblies

We specialize in manufacturing high-precision components that form the core of minimally invasive and implantable devices — full assembly and sub-assembly manufacturing.

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Marking of stainless steel tubing
.010" to 6.00" diameter

Capabilities & Specifications

Linear graduation marking
1mm to 50cm capability

Capabilities & Specifications

Part A

Capabilities & Specifications:

304 Stainless steel hypo-tube – rotational cutting
Tube = .153" X .007" wall
Array of 24 holes = .007" diameter each
Perimeter holes = .032" diameter
Kerf widths = .012" to .015"

Part B

Flat sheet stock cutting

Cutting

Advanced laser cutting that delivers clean edges, consistent inner and outer diameters, burr-free edges and precise geometries every time.

Ablation

From functional texturing to high-resolution marking, our laser ablation solutions enhance performance, identification, and compliance across complex device surfaces.

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